Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Softcover - 9783319374970 6Hybridkarten42

6Hybridkarten42

2Ladder-Optionen25

der Clusteranalyse

Betrachtung unter demographischen Gesichtspunkten

1Konstruktivismus30

Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Softcover - 9783319374970 6Hybridkarten42This book presents a wide band and technology independent, SPICE compatible RLC model for through silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for